| PART |
Description |
Maker |
| PRECIUM |
PRECIUM SWEEP
|
MPS Industries, Inc.
|
| MICRF008YM MICRF00811 |
QwikRadio Sweep-Mode Receiver
|
Micrel Semiconductor
|
| 0908160326 90816-0326 |
1.27mm (.050) Pitch Picoflex SMT Latched Vertical Header, 26 Circuits, Tin (Sn) Plating, Black
1.27mm (.050") Pitch Picoflex SMT Latched Vertical Header, 26 Circuits, Tin (Sn) Plating, Black
MOLEX Connector
|
Molex Electronics Ltd.
|
| 0942403318 94240-3318 SD-94240-001 |
2.54mm (.100) Pitch, MOX Header, 3.50mm (.137) Grid, Through Hole, PBT, Vertical, 18 Circuits, Black
2.54mm (.100") Pitch, MOX Header, 3.50mm (.137") Grid, Through Hole, PBT, Vertical, 18 Circuits, Black
MOLEX Connector
|
Molex Electronics Ltd.
|
| 90130-1268 0901301268 |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 68 Circuits, Black 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 68 Circuits, Black 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 90130-1218 0901301218 |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 18 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 18 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 90130-1216 0901301216 |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 16 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 16 Circuits, Black, 0.38楼矛m (15楼矛") Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 34695-0100 |
Stac64?Single Bay Vertical Power Header, 10 Circuits, Polarization A, Black, Tray
|
Molex Electronics Ltd.
|
| 0780790012 78079-0012 |
1.00mm (.039) Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins, Black Housing and Latches, 0.76渭m (30渭) Gold (Au) Plating
1.00mm (.039) Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins, Black Housing and Latches, 0.76μm (30μ) Gold (Au) Plating
|
Molex Electronics Ltd.
|
| 0780790011 78079-0011 |
1.00mm (.039) Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins, Black Housing and Latches, 0.76渭m (30渭) Gold (Au) Plating
1.00mm (.039) Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins, Black Housing and Latches, 0.76μm (30μ) Gold (Au) Plating
|
Molex Electronics Ltd.
|
| 0877159900 87715-9900 |
1.00mm (.039) Edgecard Connector, Vertical, Nylon 4/6 Glass-filled, Black Housing, Phosphor Bronze, 0.38μm (15μ) Gold (Au) Plating, with Plastic Pegs
1.00mm (.039) Edgecard Connector, Vertical, Nylon 4/6 Glass-filled, Black Housing, Phosphor Bronze, 0.38渭m (15渭) Gold (Au) Plating, with Plastic Pegs
|
Molex Electronics Ltd.
|
| 34707-2050 |
Stac64?2 Bay Vertical Headers, 36 Circuits, Bay A 20 Circuit Signal Header, Polarization A, Black; Bay B 16 Circuit Signal Header, Polarization A, Black, Tray
|
Molex Electronics Ltd.
|
|
